- Overview: Preparation of high quality optical and polished thin sections, polished blocks, doubly polished wafers, fluid inclusion wafers, grain mounts etc.
- Contact name: Harri Williams, Thin Section Technician
- Phone: +44 (0)113 343 5230
- Email: firstname.lastname@example.org
Logitech LP 50 lapping machine, Buehler PetroThin Sectioning machine, 2 x Buehler Ecomet 250 Polisher Grinders 10’’ plate with Auto Met 250 heads. Various other saws, grinders and 2 x Syton polishers.
Optical and electron microscopy, laser ablation, cathodoluminesence etc.